111 | Hong-Mei Dai, Bo-Hao Chen, Chao-Ming Hsu,* and Cheng-Fu Yang,Design and Analysis of New Electric Motorcycle: Analysis of Bending Moment Stiffness, Sensors and Materials,34, pp1733–1746,(SCI) |
111 | Yuchun Yang, Zhi-Hong Lin, Chao-Ming Hsu,* and Cheng-Fu Yang,Effects of Forced Convection on the Deformation Values of 3D-printed Nylon Thin-walled Specimens, Sensors and Materials,34, pp1665–1673,(SCI) |
111 | Yuchun Yang, Zhi-Hong Lin, Chao-Ming Hsu,* and Cheng-Fu Yang,Effect of Temperature Field on Deformation of 3D-Printed Polylactic Acid Objects under Forced Convection, Sensors and Materials,34, pp1675–1684,(SCI) |
111 | Shuai He, Kao-Chi Chen, Chao-Ming Hsu,* and Cheng-Fu Yang,Design of 13 Million Pixel Camera for Cellphone Applications, Sensors and Materials,34, pp1685–1696,(SCI) |
111 | Jun Dai,Yao-Chung Yang, Chao-Ming Hsu,* Hsien-Wei Tseng, Peng Wang,and Cheng-Fu Yang,Effects of Forced Convection on the Deformation Values of 3D-printed Nylon Thin-walled Specimens, Sensors and Materials,34, pp2577–2589,(SCI) |
110 | Xueyan Li, Yao-Chung Yang, Chao-Ming Hsu,* Hsien-Wei Tseng, Jie Zhang, and Cheng-Fu Yang,Simulation of Effect of Ar Flow Rate on Silicon Ingot Growth in Directional Solidification System, Sensors and Materials,33, pp2607–2618,(SCI) |
110 | Jun Dai, Yao-Chung Yang, Chao-Ming Hsu,* Hsien-Wei Tseng, Peng Wang, and Cheng-Fu Yang,Simulation Analysis of Silicon Ingot Growth in Directional Solidification System, Sensors and Materials,33, pp2577–2589,(SCI) |
109 | Ah-Der Lin, Wen-Kai Yu, Sian Zheng Poon, Cheng-Yi Chen, Chao-Ming Hsu, Study on Nitrogen-Doped Graphene Ink and Its Effects on the Heat Dissipation for the LED Lamps,Applied Sciences,10,(SCI) |
108 | Tsung-Pin Hung, Chao-Ming Hsu, Hsiu-An Tsai, Shuo-Ching Chen and Zong-Rong Liu,Temperature Field Numerical Analysis Mode and Verification of Quenching Heat Treatment Using Carbon Steel in Rotating Laser Scanning,Materials,12,(SCI) |
108 | Cheng-Fu Yang, Wei-Lung Pai, Chao-Ming Hsu, Cheng-Yi Chen,Mechanical Properties of Cobalt-based Alloy Coating Applied Using High-velocity Oxygen Gas and Liquid Fuel Spraying Processes,Sensors and Materials,31, pp531-542,(SCI) |
108 | Ah-Der Lin, Sian Zheng Poon, Hong-Wei Tu, Cheng-Yi Chen, Chao-Ming Hsu,Study on Thermoelectric Conversion and Conjugate Heat Transfer for PCBA by Finite Element Analysis,Applied Sciences,10,(SCI) |
107 | Ah-Der Lin, Chi-Liang Kung, Sung-Po Hsu, Chao-Ming Hsu*, Cheng-Yi Chen,Effects of Coating Film Parameters on Thermal and Stress Distributions of Glass-Based Phosphor-Converted Color Wheels,Coatings,8,(SCI) |
107 | Ah-Der Lin, Chi-Liang Kung, You-Qing Cao, Chao-Ming Hsu,Cheng-Yi Chen,Stainless Steel Surface Coating with Nanocrystalline Ag Film by Plasma Electrolysis Technology,Coatings,8,(SCI) |
107 | Cheng-Yi Chen, Rong-Ching Wu, Bing-Jyun Tsai, and Chao-Ming Hsu,Design and Analysis of an Electrical Magnetic Holding Device, Microsystem Technologies,1, pp1-12,(SCI) |
107 | Ah-Der Lin, Chi-Liang Kung, Wei-Chen Hsieh,Chao-Ming Hsu, Cheng-Yi Chen,Study on Cleaning the Surface of Stainless Steel 316 Using Plasma Electrolysis Technology, Applied Sciences,8,(SCI) |
107 | Ah-Der Lin, Chi-Liang Kung, Wei-Chen Hsieh,Chao-Ming Hsu, Cheng-Yi Chen,Study on Cleaning the Surface of Stainless Steel 316 Using Plasma Electrolysis Technology, Applied Sciences,8,(SCI) |
107 | Chi-Liang Kung, Ah-Der Lin, Po-Wei Huang,Chao-Ming Hsu,Estimation formula for residual stress from the blind-hole drilling method,Advances in Mechanical Engineering,10, pp1-11,(SCI) |
107 | Chien-Hao Kao, Chia-Chun Chen, Wei-Yi Jhu, Yu-Tza Tsai, Shinn-Horng Chen, Chao-Ming Hsu,Cheng-Yi Che,Novel digital glove design for virtual reality applications,Microsystem Technologies,24, pp4247-4266,(SCI) |
106 | Chi-Liang Kung, Cheng-Kuang Hung, Chao-Ming Hsu, Cheng-Yi Chen,Residual Stress and Deformation Analysis in Butt Welding on 6 mm SUS304 Steel with Jig Constraints Using Gas Metal Arc Welding,Applied Sciences,7,(SCI) |
106 | Cheng-Yi Chen, Rong-Ching Wu, Chung-Long Pan, Chao-Ming Hsu and Shinn-Horng Chen,Embedded controller design for curtain motor operation with Bluetooth and Modbus communication,ICIC Express Letters Part B: Applications,8, pp1243-1252,(EI) |
105 | Kun-Neng Chen, Chao-Ming Hsu, Jing Liu, Yi-Tang Chiu and Cheng-Fu Yang,Effect of Different Heating Process on the Photoluminescence Properties of Perovskite Eu-Doped BaZrO3 Powder,Applied Sciences,6, pp1-12,(SCI) |
105 | Jao-Hwa Kuang, Chao-Ming Hsu, Ah-Der Lin,Determination of piezoelectric parameters from the measured natural frequencies of a piezoelectric circular plate, Integrated Ferroelectrics,168, pp36-52,(SCI) |
105 | Fang-Hsing Wang, Kun-Neng Chen, Chao-Ming Hsu, Min-Chu Liu and Cheng-Fu Yang,Investigation of the Structural, Electrical, and Optical Properties of the Nano-Scale GZO Thin Films on Glass and Flexible Polyimide Substrates,Nanomaterials,6, pp1-13,(SCI) |
105 | Jao-Hwa Kuang, Chao-Ming Hsu, Ah-Der Lin,The Coffin-Manson Formula for Unleaded Sn/3.0Ag/0.5Cu Solder,Integrated Ferroelectrics,172, pp200-214,(SCI) |
105 | Kun-Neng Chen, Chao-Ming Hsu, Jing Liu, Yu-Chen Liou and Cheng-Fu Yang,Investigation of Antireflection Nb2O5 Thin Films by the Sputtering Method under Different Deposition Parameters,Micromachines,7, pp1-12,(SCI) |
105 | Wei-Yi Chan, Chao-Ming Hsu,"Extraction of the Engineering Inverse Algorithm for LED Laser Eutectic Die Bonding Process Parameters,Applied System Innovation, pp371-375,(AHCI) |
105 | Hong-Wei Tu , Che-Chia Tsao , Xiao-Qing Lin , Chao-Ming Hsu, Ah-Der Lin, Cheng-Yi Chen,Design and Manufacture of Dual Axis Solar Tracker Structure,ICIC Express Letters Part B:Applications,7, pp1917-1923,(EI) |
104 | Jao-Hwa Kuang, Chao-Ming Hsu, Ah-Der Lin,A Study on the Conductivity Variation of Au-Coated Conductive Particles in ACF Packaging Process,Journal of Nanomaterials,2015, pp1-8,(SCI) |
104 | ,Investigation of the High Mobility IGZO Thin Films by Using Co-Sputtering Method,8, pp2769-2781,(SCI) |
104 | Te-Ching Hsiao, Wei-Chen Hsieh, Chun-Fu Yang, Cheng-Yi Chen, Chao-Ming Hsu,The Design of the Directional Solidification Block in the Directional Solidification System Furnace,ICIC Express Letters Part B:Applications,06, pp3291-3297,(EI) |
103 | Cheng-Yi Chen, Xiaoqing Lin, Sung-Tsun Shih, Chao-Ming Hsu, Chien-Yuan Liu,Mechanism Design and Analysis for Solar Tracking System with 500W Power Output,Lecture Note in Electrical Engineering,293, pp195-204,(EI) |
103 | Bo-Rong Qiu, Cheng-Han Lin, Ah-Der Lin, Chao-Ming Hsu,The Fatigue Life Analysis of the VCSEL with Sn/Pb and Sn/Ag/Cu Solder,Lecture Notes in Electrical Engineering,293, pp111-120,(EI) |
103 | Xiao-Qing Lin, Jhao-Jhong Su, Chao-Ming Hsu, Ah-Der Lin,Process Parameters Optimization of Micro Plasma Welding for Small-scaled SUS 304 Pipe,Lecture Notes in Electrical Engineering ,293, pp101-110,(EI) |
103 | Da-Yun Huang, Shu-Lan Ke, Chien-Kuei Chang, Chao-Ming Hsu,Expedited Stabilization of Furnace Slag Produced from Basic Oxygen Steelmaking,Lecture Notes in Electrical Engineering,293, pp81-90,(EI) |
102 | S. C SUN, C. Y. HUANG, CHAO MING HSU, AND JAO HAW KUANG1,The Effect of Nano-Scale Local Defects on Mechanical Properties of Silicon and Diamond Films,Journal of Integrated Ferroelectric,143, pp1~9,(SCI,SSCI) |
102 | ,Simulation and Analysis on the Blind Hole Method Using the Finite Element Method,Applied Mechanics and Materials,328, pp990~994,(SSCI) |
102 | ,The Temperature and Residual Stress Distributions of Butt Weld Pass on Nickel Alloy 690 Plate,Advanced Materials Research,690-693, pp2651~2654,(SSCI) |
102 | ,Using Nano Indentation Techniques to Investigate the Young’s Moduli for Human Teeth of Different Ages,Journal of Bionanoscience,7, pp154~158,(SCI,SSCI) |
102 | ,Shear Toughness Evaluation of Solder Joints for the Reliability Tests,Applied Mechanics and Materials,311, pp467~471,(SSCI) |
102 | ,The Squeeze Film Damping Effect on Dynamic Responses of Micro-electromechanical Resonators,Applied Mechanics and Materials,284-287, pp1961~1965,(SSCI) |
102 | ,The Local Defect Effect on Molecular Local Density State in Carbon Diamond Structures,Applied Mechanics and Materials,275-277, pp1810~1813,(SSCI) |
102 | ,Residual Stress and Bead Profile Analysis of Pulsed Nd: YAG Laser Lap Welding,Advanced Material Research,284-287, pp915~918,(SSCI) |
102 | Hui-Lung Chien, Chao-Ming Hsu, Ah-Der Lin , Tsung-Pin Hung, Yung-Yu Chen, Jao-Hwa Kuang,The Effect of Plaque and Artery Parameters on Stent Expansion during the Implantation Process,Life Science,10, pp1717~1720,(SCI,SSCI) |
102 | ,The Growth of Mouse Osteoblast Cell under Vibration Wave in Vitro,Life Science,10, pp1721~1726,(SCI,SSCI) |
102 | Chao-Ming Hsu, Ah-Der Lin, Jao-Hwa Kuang,The Creep Parameters of SAC305 Unleaded Solders,Advances in Materials Science and Engineering,2013, pp1-10,(SCI) |
101 | ,The Squeeze Film Effect on Micro-electromechanical Resonators,Journal of Vibroengineering,14, pp1486~1493,(SCI,SSCI) |
101 | ,Stainless Steel Surface Etching Morphologies Using Electro Plasma Technology,Advanced Science Letters,13, pp178~182,(SSCI) |
101 | ,An Investigation on the Shear Toughness for Sn/3.0Ag/0.5Cu and Sn/37Pb Solder Ball Joints,Advanced Material Research,476-478, pp2455~2458,(SSCI) |
101 | ,The Surface Absorption Coefficient of S304L Stainless Steel by Nd: YAG Micro-Pulse Laser,Advanced Material Research,472-475, pp2531~2534,(SSCI) |
101 | ,Enhancement of coupling efficiency of butterfly package laser modules based on Post-Weld-Shift compensation,Applied Mechanics and Materials,145, pp109~113,(SSCI) |
100 | ,The Effect of Residual Stress on Coupling Power Loss of VCSEL Modulus,American Journal of Engineering and Technology Research,11, pp618~621,(SSCI) |
99 | ,Dynamic Behavior of Globoidal Cam Systems with Torque Compensation Mechanisms,Mechanism and Machine Theory,45, pp1201~1214,(SCI,SSCI) |
94 | 光灼華,許兆民,The Residual Stress and Post-Weld-Shift Distributions in VCSEL Packaging,Engineering Science & Technology Bulletin NSC,81, pp168~171 |
92 | ,Effect of Temperature Cycling on Angular Alignment on Angular Alignment in Add/Drop Filter Module Packaging,J. of Electronic Materials,32, pp137~141,(SCI,SSCI) |
| 7、 Xueyan Li, Yao-Chung Yang, Chao-Ming Hsu,* Hsien-Wei Tseng, Jie Zhang, and Cheng-Fu Yang,Simulation of Effect of Ar Flow Rate on Silicon Ingot Growth in Directional Solidification System, Sensors and Materials,33, pp2607–2618,(SCI) |
| 6、 Jun Dai, Yao-Chung Yang, Chao-Ming Hsu,* Hsien-Wei Tseng, Peng Wang, and Cheng-Fu Yang,Simulation Analysis of Silicon Ingot Growth in Directional Solidification System, Sensors and Materials,33, pp2577–2589,(SCI) |
| Yuchun Yang, Zhi-Hong Lin, Chao-Ming Hsu,* and Cheng-Fu Yang,Effects of Forced Convection on the Deformation Values of 3D-printed Nylon Thin-walled Specimens, Sensors and Materials,34, pp1665–1673,(SCI) |
| Yuchun Yang, Zhi-Hong Lin, Chao-Ming Hsu,* and Cheng-Fu Yang,Effect of Temperature Field on Deformation of 3D-Printed Polylactic Acid Objects under Forced Convection, Sensors and Materials,34, pp1675–1684,(SCI) |
| Shuai He, Kao-Chi Chen, Chao-Ming Hsu,* and Cheng-Fu Yang,Design of 13 Million Pixel Camera for Cellphone Applications, Sensors and Materials,34, pp1685–1696,(SCI) |
| Hong-Mei Dai, Bo-Hao Chen, Chao-Ming Hsu,* and Cheng-Fu Yang,Design and Analysis of New Electric Motorcycle: Analysis of Bending Moment Stiffness, Sensors and Materials,34, pp1733–1746,(SCI) |
| Jun Dai,Yao-Chung Yang, Chao-Ming Hsu,* Hsien-Wei Tseng, Peng Wang,and Cheng-Fu Yang,Effects of Forced Convection on the Deformation Values of 3D-printed Nylon Thin-walled Specimens, Sensors and Materials,(SCI) |